Images all the way.ViSCO Technologies Corporation

Images all the way.ViSCO Technologies Corporation

BGA Inspection
Inspection can be started with simple
settings BGA dedicated tool

It is possible to easily set up ball pattern
inspections and immediately start inspecting.

Are you struggling with problems like these?

Setting up is
complex and
takes too
much time.
Few balls can be
egistered, and the
scope that can be
handled is limited.
I want to inspect
the ball height
at the same time.

ViSCO Technologies can help!

Quick inspections possible using special BGA tools

The VTV-9000 series includes a "BGA inspection tool" as a visual inspection tool for BGA (ball grid array) packages (rear surface). Because it is a special-purpose tool, inspections settings such as ball/pattern training can be easily performed, so inspections can be conducted without delay.

・The number of balls that can be trained is 100×100 = 10,000 (max.)
・A function that can easily perform ball training
・Ball cropping (automatic, manual)
・Ball models are integration models
・Masks can be put on ball models
・Each ball's score and contrast can be checked
・Ball position is automatically set

Inspection items

To set inspection items, simply select pre-prepared items.

Ball quality:Search score, contrast
Ball external form:Ball diameter, ball roundness
Ball position:X difference, Y difference, XY difference

Many inspection items and combined inspections

The systems in the VTV-9000 series are not BGA-dedicated inspection systems. By adding various general-purpose inspection tools (package detection/inspection, blob inspection, DefFinder®: general-purpose visual inspections, etc), various combined inspections can be created.

Back side

Front side

Package detection / inspection

ptimal straight lines from the edges of package boundaries are calculated, and points of intersection between them are used
to detect package positions. The detected package information makes various inspections possible.

◯Package width
◯Package height
◯Package warping
◯Package chip
◯Inclusion of foreign matter

High-accuracy dynamic mask to reduce false reject / escape

Even for inspection targets like silicon chips that tend to vary in size, a mask for each chip is created along each rectangular edge.
Mask output will be precisely done for each target.

  • Chamfer the corner
  • Round off the corner
  • Round off the corner (inward)

Inspections with two or more types of illumination conditions using illumination control

Not all inspections can be conducted with one set of illumination conditions. The VTV-9000 series uses a Lighting Controller that allows machine vision to turn the LED illumination ON/OFF and modulate the amount of light as required. By allowing illumination conditions to be changed, only the most appropriate illumination conditions can be used to suit inspection items, resulting in more reliable, precise inspections.

Illumination condition1

Illumination condition2

Introduction to our company

As an expert group in the field of visual inspections and image processing inspections, we provide products that continue to lead the industry.

We are an expert group in the field of visual inspections and image processing inspections. We are not just a manufacturer. Instead, we are a visual inspection and image processing inspection system manufacturer that combines knowledge of and experience related to image processing algorithms, optical technology, electronics, and machinery in order to provide comprehensive consulting as a development engineering company.

Inquiries / Support
Please feel free to contact us with any questions or concerns related to our various products.
Contact us by phone
(direct line to sales dept.)
Contact us on the web
InquiriesYou can send inquiries to us here
Support HotlineYou can send technical inquiries to us here

Contact Us・Related Information