Images all the way.ViSCO Technologies Corporation

Images all the way.ViSCO Technologies Corporation

Responding to Demanding Inspection
Requirements Resulting from

Because we provide the BGA inspection tools and other tools necessary for visual
inspections of semiconductor packages, high-precision inspections
can easily be achieved without the need to incorporate programs.

Inspection Examples

BGA and CSP ball existence/chip inspections

Lead frame deformation/chip inspections

There are also many examples that are not shown here.
If you have any questions about the feasibility of inspections with our company's products, etc., please feel free to send us an inquiry.

Customer feedback

The settings can be specified similarly to when using Excel (PC), and changing or adding types is much easier than when using the products of other companies.
Because the sample evaluation test gave me a clear idea of what is and is not possible, I was able to proceed without worry.
Switching the lighting was simple, and I was able to easily set up task-type development.

Inspection of various items by using composite tools

The addition of various general purpose inspection tools (package detection / inspections, blob inspections, DefFinder®: general purpose visual inspections, etc.) makes various types of composite inspections possible.

Back surface

Front surface

Package detection / inspection

ptimal straight lines from the edges of package boundaries are calculated, and points of intersection between them are used
to detect package positions. The detected package information makes various inspections possible.

◯Package width
◯Package height
◯Package warping
◯Package chip
◯Inclusion of foreign matter

High-accuracy dynamic mask to reduce false reject / escape

Even for inspection targets like silicon chips that tend to vary in size, a mask for each chip is created along each rectangular edge.
Mask output will be precisely done for each target.

  • Chamfer the corner
  • Round off the corner
  • Round off the corner (inward)

Lighting conditions can be switched for multiple inspections.

The lighting conditions can be switched to the ones that are optimal for the inspection items to achieve consistent inspections.

Lighting conditions 1

Package-chip inspection

Lighting conditions 2

Ball-internal foreign matter inspection

Introduction to our company

As an expert group in the field of visual inspections and image processing inspections, we provide products that continue to lead the industry.

We are an expert group in the field of visual inspections and image processing inspections. We are not just a manufacturer. Instead, we are a visual inspection and image processing inspection system manufacturer that combines knowledge of and experience related to image processing algorithms, optical technology, electronics, and machinery in order to provide comprehensive consulting as a development engineering company.

Inquiries / Support
Please feel free to contact us with any questions or concerns related to our various products.
Contact us by phone
(direct line to sales dept.)
Contact us on the web
InquiriesYou can send inquiries to us here
Support HotlineYou can send technical inquiries to us here

Contact Us・Related Information