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Product Overview
 

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

The VP Series is an all-in-one system that includes features necessary for performing post-process appearance inspections for the manufacture of semiconductors/electronic parts.


All-in-one design – Supports post-process appearance inspections for the manufacture of semiconductors/electronic parts

[1] In Pocket Package appearance inspection

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

The most common need regarding taping machines is the ability to perform a lead pin inspection after inserting a device in embossed tape. The VP series allows you to accurately measure if the lead pin was bent when the device was inserted. In addition to lead inspection, you can also perform a direction inspection, mark inspection, and mold defect inspection.

[2] BGA ball surface appearance inspection

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

The VP series allows you to perform an inspection to check for ball presence, pitch, circularity, deformation, displacement of the ball group from the package perimeter, etc. on the ball surface of a highly dense BGA package.

[3] Device side surface lead pin inspection

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

For the lead pins of surface mount devices, it is necessary to measure standoff using a side field of view. The VP series provides inspection functions that support an imaging environment that uses mirrors and prisms.

[4] Part position measurement

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

In addition to an appearance inspection, it is also necessary to accurately measure the position of a part for transporting and mounting. Position inspection and rectangle position inspection provide functions that output the position and tilt of the target object as numerical data.

[5] 14 types of inspection functions to support a wide variety of inspections

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

The VP series provides 14 types(*) of inspection functions that can be combined to create an inspection procedure. By combining these inspection functions, you can create a custom inspection procedure that meets your needs.
*A total of 14 types of inspections: Mark Inspection, Presence Inspection, Lead Inspection, Area Inspection, Pitch Inspection, Rotation Correction, Distance Inspection, Position Inspection, Electrode Inspection, BGA Inspection, Rectangle Position Inspection, Component Inspection, Rotation Matching, and Ball Inspection


Standard support for CCD double-speed cameras – Supports complete high-speed processing

[1] Standard support for CCD double-speed cameras - enables you to capture the exact moment

The VP series supports a random trigger function for CCD double-speed cameras.
It allows you to significantly improve the image acquisition time compared to an NTSC compliant standard CCD camera.
By using the partial scan function or interlaced acquisition function on the CCD double-speed camera, image acquisition at an even higher speed is possible.

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

* Only CCD cameras designated by our company are supported.
* Partial scan and interlaced acquisition functions are limited to CCD cameras that support these functions.
* For interlaced acquisition, the vertical resolution will be 1/2 of the standard resolution.


[2] Speed up the process by simultaneously acquiring images from 2 CCD cameras

The VP series has 2 image input circuits, allowing you to simultaneously acquire images from 2 CCD cameras.
This allows you to reduce the image acquisition time.

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

*When connecting multiple CCD cameras, you need to use the same type of CCD camera.
*To simultaneously acquire images from multiple CCD cameras, the cameras must be connected to the specified channels.


Supports 3D measurements (coplanarity, standoff) – Supports advanced needs

3 high-resolution cameras can be used to perform SOP/QFP or BGA/CSP appearance inspections.
In the basic configuration, 1 camera can be used for 2D measurements and the remaining 2 cameras can be used for 3D measurements (coplanarity, standoff).

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

*To perform both SOP/QFP and BGA/CSP inspections, a total of 4 cameras will be necessary.


Detailed functions that support various operations - supports manufacturing needs

[1] Rotation correction function for correcting the position offset of a target object

The rotation correction function corrects the tilt or offset in position of an object to be inspected, enabling a stable inspection.
(Below are illustrations of the rotation correction function. The figure on the right shows how the tilted image is detected and automatically corrected to a straight position).

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

[2] Defective image storage function useful for analyzing defects

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

When a target object is determined to be defective during operation, you can save the image of that object to the hard disk. The saved image can be used to manually perform a reinspection. The system can also be set to save the images of all objects that were inspected.

[3] Record inspection results as numerical data

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

In most of the inspection functions, a pass/fail determination is made by comparing the measured numerical data with a preconfigured determination value. The statistical data output function can be used to store the measured numerical data as a comma delimited data file to the hard disk. The statistical data file can be exported to a USB memory, allowing you to perform a numerical analysis of the trends in defects on a PC.

[4] Image splitting function for simultaneously displaying multiple camera images

The display screen for the inspection can be set to full screen, vertical half split screen, horizontal half split screen, quarter split screen, or minimized quarter split screen.
This allows you to simultaneously monitor images from all cameras when multiple cameras are connected.


Standard support for 3 languages: Japanese, English, Chinese – Supports overseas operations

[1] Standard support for 3 languages

The system offers standard support for 3 languages: Japanese, English, and Simplified Chinese.
The language can be instantly switched by selecting the language from the menu so that maintenance can be performed in Japanese overseas and then easily changed back to English to perform operations.

VP-1000/5000 Vision Processing and Inspection Device for Semiconductors and Electronic Parts

[2] Shipped with USB memory

The system comes with USB memory which is useful for backing up product type data and image data created on the VP-1000 or for upgrading the software.


Full technical support

Our experienced application engineers will provide full support from selecting optical options (camera, lens, lighting, etc.) to building applications.

Hardware Specifications

PC part Intel CPU or compatible CPU
OS Windows 2000
Camera connectivity 2~12
Power Supply AC 100 V±10 V (50 / 60 Hz)
Power Consumption 330 W or less
Serial RS-232C×2
I/O connection points Digital I/O 16/16 (Photo-coupler isolated open collector)
Size VP-1000:300(W)×90(H)×335(D)mm
VP-5000:430(W)×160(H)×330(D)mm
Weight VP-1000:Approx. 4.9 Kg
VP-5000:Approx. 12 Kg

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